Please use this identifier to cite or link to this item: https://repository.uksw.edu//handle/123456789/27475
Title: Logam Tembaga (Cu) sebagai Alternatif Pengganti Nikel (Ni) dalam Proses Pelapisan Aluminium pada PT. Promanufacture Salatiga/Formulatrix
Other Titles: Copper (Cu) as an Alternative to Nickel (Ni) in the Aluminum Coating Process at PT. Promanufacture Salatiga/Formulatrix
Authors: Florencia, Tassya Ervina
Keywords: elektroplating nikel;elektroplating tembaga;aluminium;uji ketebalan;optimasi;nickel electroplating;copper electroplating;aluminum;thickness test;optimization
Issue Date: 18-Jul-2022
Abstract: PT. Promanufacture Indonesia / Formulatrix menggunakan metode elektroplating, karena caranya sederhana dan biayanya murah. Formulatrix menggunakan nikel sebagai pelapis aluminium. Pelapisan menggunakan nikel cukup mahal, sehingga perlu alternatif logam pelapis yang lebih ekonomis dengan kualitas yang lebih bagus atau sama dengan hasil elektroplating nikel. Penelitian ini menggunakan tembaga (Cu) sebagai alternatif pengganti nikel karena prosesnya sederhana, larutan elektrolitnya mudah dikontrol, dapat memperlambat korosi, daya hantar listrik dan panas yang baik, serta dapat menghasilkan permukaan yang halus dan cerah. Elektroplating tembaga dilakukan dengan tegangan konstan dan perlu variasi suhu, waktu, dan rapat arus. Tujuan penelitian ini adalah optimasi proses pelapisan logam aluminium dengan menggunakan logam tembaga (Cu) berdasarkan suhu, waktu, dan rapat arus. Penilaian didasarkan pada visual, ketebalan lapisan, dan korosifitas setelah dilapisi. Hasil penelitian menunjukkan bahwa secara visual hasil yang didapat cerah dan mengkilap. Untuk memperoleh kondisi yang optimal, digunakan metode Respons Surface Methodology (RSM) dan desain optimasi 35 Central Composite Design (CCD) dengan 3 peubah dan 5 level faktor, kemudian dianalisis menggunakan uji ANOVA. Proses optimasi hanya menggunakan data uji ketebalan tanpa melibatkan data korosifitas dikarenakan tidak adanya perbedaan tingkat korosifitas antar perlakuan. Prediksi model optimasi yang didapat adalah quadratic dengan variasi suhu 43°C, waktu 47 menit, dan rapat arus 5,7 A/dm2 sehingga dihasilkan ketebalan aktual lapisan tembaga (Cu) sebesar 0,1087 mm. Dalam penelitian ini suhu mempengaruhi proses elektroplating, namun berdasarkan hukum faraday yang mempengaruhi proses elektroplating hanya waktu dan kuat arus. Pengaruh apa yang ditimbulkan oleh suhu belum diketahui. Sehingga, perlu dilakukan penelitian lebih lanjut terkait hal ini.
PT. Promanufacture Indonesia / Formulatrix uses the electroplating method, because the method is simple and the cost is low. Formulatrix uses nickel as an aluminum coating. Plating using nickel is quite expensive, so it is necessary to have an alternative coating metal that is more economical with better quality or the same as the results of nickel electroplating. This research uses copper (Cu) as an alternative to nickel because the process is simple, the electrolyte solution is easy to control, can slow down corrosion, conduct electricity and heat well, and can produce a smooth and bright surface. Copper electroplating is carried out with a constant voltage and requires variations in temperature, time, and current density. The purpose of this research is to optimize the aluminum metal plating process using copper (Cu) based on temperature, time, and current density. Assessment is based on visuals, coating thickness, and corrosiveness after coating. The results showed that visually the results obtained were bright and shiny. To obtain optimal conditions, the Response Surface Methodology (RSM) method and optimization design 35 Central Composite Design (CCD) with 3 variables and 5 factor levels, then analyzed using ANOVA test. The optimization process only uses thickness test data without involving corrosive data because there is no difference in the level of corrosiveness between treatments. The prediction of the optimization model obtained is quadratic with a temperature variation of 43°C, time of 47 minutes, and a current density of 5.7 A/dm2 so that the actual thickness of the copper layer (Cu) is 0.1087 mm. In this study, temperature affects the electroplating process, but based on Faraday's law, only time and current strength affect the electroplating process. What effect the temperature has is not yet known. Thus, further research is needed in this regard.
URI: https://repository.uksw.edu//handle/123456789/27475
Appears in Collections:T1 - Chemistry

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